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A chip and a digital twin of the chip

Product decisions within electronics and semiconductor

Electronics and Semiconductor companies face ongoing and increasing market challenges with complexity, new technology adoption, and market drivers such as 5G communication, automotive electrification and autonomous driving, beside trends toward miniaturization, higher power density and lower costs requirement. To address these competitively, greater prediction and understanding of product physical performance, and assessing reliability, earlier in development are critical.

In this webinar series, we will cover multi-discipline and multi-physics simulation solutions to support creation of a virtual digital twin of a product from early stage ideation phase and with increasing fidelity throughout development cycles to final verified design

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Thermal characterization of complex electronics: understanding structure functions
White Paper

Thermal characterization of complex electronics: understanding structure functions

半導体の過渡熱試験と構造関数解析 (熱抵抗対熱容量のプロファイル) を使用して、信頼性の高いエレクトロニクスを設計する方法を学ぶ

試験とシミュレーションでパワーエレクトロニクスの熱設計と信頼性を向上させる
Webinar

試験とシミュレーションでパワーエレクトロニクスの熱設計と信頼性を向上させる

パワー半導体 熱モデルのキャリブレーション、校正 パワーエレクトロニクス 冷却パワーエレクトロニクス 熱設計の信頼性 Simcenter Flothermを使った電子機器冷却シミュレーション パワーエレクトロニクスの熱試験 パワーエレクトロニクスの熱シミュレーションと試験 Simcenter T3STERを使ったIGBT熱特性評価